Effect of Mn Nanoparticles on Interfacial Intermetallic Compound Growth in Low-Ag Sn-0.3Ag-0.7Cu- xMn Solder Joints.
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| Title: | Effect of Mn Nanoparticles on Interfacial Intermetallic Compound Growth in Low-Ag Sn-0.3Ag-0.7Cu- xMn Solder Joints. |
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| Authors: | Tang, Y.1, tangyu_mycauc@163.com, Luo, S.1, Li, G.2, Yang, Z.3, Chen, R.2, Han, Y.3, Hou, C.1 |
| Source: | Journal of Electronic Materials; Feb2018, Vol. 47 Issue 2, p1673-1685, 13p |
| Database: | Applied Science & Technology Source |
| ISSN: | 03615235 |
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| DOI: | 10.1007/s11664-017-5886-x |
