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Effect of Mn Nanoparticles on Interfacial Intermetallic Compound Growth in Low-Ag Sn-0.3Ag-0.7Cu- xMn Solder Joints.

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Title: Effect of Mn Nanoparticles on Interfacial Intermetallic Compound Growth in Low-Ag Sn-0.3Ag-0.7Cu- xMn Solder Joints.
Authors: Tang, Y.1, tangyu_mycauc@163.com, Luo, S.1, Li, G.2, Yang, Z.3, Chen, R.2, Han, Y.3, Hou, C.1
Source: Journal of Electronic Materials; Feb2018, Vol. 47 Issue 2, p1673-1685, 13p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 127192549
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Effect of Mn Nanoparticles on Interfacial Intermetallic Compound Growth in Low-Ag Sn-0.3Ag-0.7Cu- xMn Solder Joints.
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  Data: <searchLink fieldCode="AU" term="%22Tang%2C+Y%2E%22">Tang, Y.</searchLink><relatesTo>1</relatesTo>, <i>tangyu_mycauc@163.com</i><br /><searchLink fieldCode="AU" term="%22Luo%2C+S%2E%22">Luo, S.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+G%2E%22">Li, G.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yang%2C+Z%2E%22">Yang, Z.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+R%2E%22">Chen, R.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Han%2C+Y%2E%22">Han, Y.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Hou%2C+C%2E%22">Hou, C.</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Feb2018, Vol. 47 Issue 2, p1673-1685, 13p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=127192549
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        Value: 10.1007/s11664-017-5886-x
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        Text: English
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      – TitleFull: Effect of Mn Nanoparticles on Interfacial Intermetallic Compound Growth in Low-Ag Sn-0.3Ag-0.7Cu- xMn Solder Joints.
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              Text: Feb2018
              Type: published
              Y: 2018
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