Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test.
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| Title: | Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test. |
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| Authors: | Mo, Liping1, Guo, Chaowei2, Zhou, Zheng1, Wu, Fengshun1, fengshunwu@hust.edu.cn, Liu, Changqing3, C.Liu@lboro.ac.uk |
| Source: | Journal of Materials Science: Materials in Electronics; Jul2018, Vol. 29 Issue 14, p11920-11929, 10p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-018-9293-8 |
