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Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test.

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Title: Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test.
Authors: Mo, Liping1, Guo, Chaowei2, Zhou, Zheng1, Wu, Fengshun1, fengshunwu@hust.edu.cn, Liu, Changqing3, C.Liu@lboro.ac.uk
Source: Journal of Materials Science: Materials in Electronics; Jul2018, Vol. 29 Issue 14, p11920-11929, 10p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 130276725
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test.
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  Data: <searchLink fieldCode="AU" term="%22Mo%2C+Liping%22">Mo, Liping</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Guo%2C+Chaowei%22">Guo, Chaowei</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhou%2C+Zheng%22">Zhou, Zheng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wu%2C+Fengshun%22">Wu, Fengshun</searchLink><relatesTo>1</relatesTo>, <i>fengshunwu@hust.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Liu%2C+Changqing%22">Liu, Changqing</searchLink><relatesTo>3</relatesTo>, <i>C.Liu@lboro.ac.uk</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jul2018, Vol. 29 Issue 14, p11920-11929, 10p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=130276725
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        Value: 10.1007/s10854-018-9293-8
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      – Code: eng
        Text: English
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        StartPage: 11920
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      – TitleFull: Microstructural evolution of Cu-Sn-Ni compounds in full intermetallic micro-joint and in situ micro-bending test.
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            NameFull: Zhou, Zheng
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            NameFull: Wu, Fengshun
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              M: 07
              Text: Jul2018
              Type: published
              Y: 2018
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