Hardness Characteristics of Au Cone-Shaped Bumps Targeted for 3-D Packaging Applications.
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| Title: | Hardness Characteristics of Au Cone-Shaped Bumps Targeted for 3-D Packaging Applications. |
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| Authors: | Ying Ying Lim1, y-lim@edu.k.u-tokyo.ac.jp, Hiroshi Nakagawa1, Masaru Hashino1, Masahiro Aoyagi1, Katsuya Kikuchi1, k-kikuchi@aist.go.jp |
| Source: | IEEE Transactions on Components, Packaging & Manufacturing Technology; Mar2019, Vol. 9 Issue 3, p419-426, 8p |
| Database: | Applied Science & Technology Source |
| ISSN: | 21563950 |
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| DOI: | 10.1109/TCPMT.2019.2893232 |
