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Hardness Characteristics of Au Cone-Shaped Bumps Targeted for 3-D Packaging Applications.

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Title: Hardness Characteristics of Au Cone-Shaped Bumps Targeted for 3-D Packaging Applications.
Authors: Ying Ying Lim1, y-lim@edu.k.u-tokyo.ac.jp, Hiroshi Nakagawa1, Masaru Hashino1, Masahiro Aoyagi1, Katsuya Kikuchi1, k-kikuchi@aist.go.jp
Source: IEEE Transactions on Components, Packaging & Manufacturing Technology; Mar2019, Vol. 9 Issue 3, p419-426, 8p
Database: Applied Science & Technology Source
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DbLabel: Applied Science & Technology Source
An: 135356273
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PubType: Academic Journal
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  Data: Hardness Characteristics of Au Cone-Shaped Bumps Targeted for 3-D Packaging Applications.
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        Value: 10.1109/TCPMT.2019.2893232
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