Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping.
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| Title: | Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping. |
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| Authors: | Zhang, Dan1,2, Xu, Jing1, Mao, Shujuan1,2, Zhao, Chao1,2, zhaochao@ime.ac.cn, Wang, Guilei1, Luo, Xue1,2, Li, Junfeng1, Li, Yongliang1, Wang, Wenwu1,2, Chen, Dapeng1, Ye, Tianchun1,2, Luo, Jun1,2, luojun@ime.ac.cn |
| Source: | Journal of Materials Science: Materials in Electronics; Jun2019, Vol. 30 Issue 11, p10579-10588, 10p |
| Database: | Applied Science & Technology Source |
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