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Experimental and numerical study on dynamic mechanical behaviors of low-silver lead-free solder under combined compression-shear loadings.

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Bibliographic Details
Title: Experimental and numerical study on dynamic mechanical behaviors of low-silver lead-free solder under combined compression-shear loadings.
Authors: Niu, Xiaoyan1, niu-xiaoyan2002@163.com, Chen, Cong1, Shen, Linlin1, Chen, Liangbiao2, Zhou, Jiang2
Source: Journal of Materials Science: Materials in Electronics; Oct2019, Vol. 30 Issue 20, p18678-18685, 8p
Database: Applied Science & Technology Source
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Description
ISSN:09574522
DOI:10.1007/s10854-019-02220-0