Nanocomposite SAC solders: the effect of adding CoPd nanoparticles on the morphology and the shear strength of the Sn–3.0Ag–0.5Cu/Cu solder joints.
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| Title: | Nanocomposite SAC solders: the effect of adding CoPd nanoparticles on the morphology and the shear strength of the Sn–3.0Ag–0.5Cu/Cu solder joints. |
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| Authors: | Yakymovych, Andriy1, yakymovychandriy@gmail.com, Slabon, Adam2, Švec, Peter3, Plevachuk, Yuriy4, plevachuk@mail.lviv.ua, Orovcik, Lubomir5, Bajana, Otto5 |
| Source: | Applied Nanoscience; Dec2020, Vol. 10 Issue 12, p4603-4607, 5p |
| Database: | Applied Science & Technology Source |
| ISSN: | 21905509 |
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| DOI: | 10.1007/s13204-020-01325-x |
