Nanocomposite SAC solders: the effect of adding CoPd nanoparticles on the morphology and the shear strength of the Sn–3.0Ag–0.5Cu/Cu solder joints.

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Title: Nanocomposite SAC solders: the effect of adding CoPd nanoparticles on the morphology and the shear strength of the Sn–3.0Ag–0.5Cu/Cu solder joints.
Authors: Yakymovych, Andriy1, yakymovychandriy@gmail.com, Slabon, Adam2, Švec, Peter3, Plevachuk, Yuriy4, plevachuk@mail.lviv.ua, Orovcik, Lubomir5, Bajana, Otto5
Source: Applied Nanoscience; Dec2020, Vol. 10 Issue 12, p4603-4607, 5p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 147340956
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Nanocomposite SAC solders: the effect of adding CoPd nanoparticles on the morphology and the shear strength of the Sn–3.0Ag–0.5Cu/Cu solder joints.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Yakymovych%2C+Andriy%22">Yakymovych, Andriy</searchLink><relatesTo>1</relatesTo>, <i>yakymovychandriy@gmail.com</i><br /><searchLink fieldCode="AU" term="%22Slabon%2C+Adam%22">Slabon, Adam</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Švec%2C+Peter%22">Švec, Peter</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Plevachuk%2C+Yuriy%22">Plevachuk, Yuriy</searchLink><relatesTo>4</relatesTo>, <i>plevachuk@mail.lviv.ua</i><br /><searchLink fieldCode="AU" term="%22Orovcik%2C+Lubomir%22">Orovcik, Lubomir</searchLink><relatesTo>5</relatesTo><br /><searchLink fieldCode="AU" term="%22Bajana%2C+Otto%22">Bajana, Otto</searchLink><relatesTo>5</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Applied+Nanoscience%22">Applied Nanoscience</searchLink>; Dec2020, Vol. 10 Issue 12, p4603-4607, 5p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=147340956
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s13204-020-01325-x
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 5
        StartPage: 4603
    Titles:
      – TitleFull: Nanocomposite SAC solders: the effect of adding CoPd nanoparticles on the morphology and the shear strength of the Sn–3.0Ag–0.5Cu/Cu solder joints.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Yakymovych, Andriy
      – PersonEntity:
          Name:
            NameFull: Slabon, Adam
      – PersonEntity:
          Name:
            NameFull: Švec, Peter
      – PersonEntity:
          Name:
            NameFull: Plevachuk, Yuriy
      – PersonEntity:
          Name:
            NameFull: Orovcik, Lubomir
      – PersonEntity:
          Name:
            NameFull: Bajana, Otto
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 12
              Text: Dec2020
              Type: published
              Y: 2020
          Identifiers:
            – Type: issn-print
              Value: 21905509
          Numbering:
            – Type: volume
              Value: 10
            – Type: issue
              Value: 12
          Titles:
            – TitleFull: Applied Nanoscience
              Type: main
ResultId 1