A model for modulus development of dual‐cure resin systems.

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Bibliographic Details
Title:	A model for modulus development of dual‐cure resin systems.
Authors:	Redmann, Alec¹, aredmann2@wisc.edu, Osswald, Tim A.¹
Source:	Polymer Engineering & Science; Mar2021, Vol. 61 Issue 3, p830-835, 6p
Database:	Applied Science & Technology Source

Description
ISSN:	00323888
DOI:	10.1002/pen.25628