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A model for modulus development of dual‐cure resin systems.

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Title: A model for modulus development of dual‐cure resin systems.
Authors: Redmann, Alec1, aredmann2@wisc.edu, Osswald, Tim A.1
Source: Polymer Engineering & Science; Mar2021, Vol. 61 Issue 3, p830-835, 6p
Database: Applied Science & Technology Source
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        Value: 10.1002/pen.25628
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              Text: Mar2021
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