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Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil.

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Bibliographic Details
Title: Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil.
Authors: Huang, Yilian1, Fu, Renli1, renlifu@nuaa.edu.cn, Chen, Xudong1, Cheng, Bo1, Agathopoulos, Simeon2, sagat@uoi.gr
Source: Journal of Materials Science: Materials in Electronics; Jun2021, Vol. 32 Issue 12, p15826-15836, 11p
Database: Applied Science & Technology Source
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ISSN:09574522
DOI:10.1007/s10854-021-06135-7