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Pressure-assisted direct bonding of copper to silicon nitride for high thermal conductivity and strong interfacial bonding strength.

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Bibliographic Details
Title: Pressure-assisted direct bonding of copper to silicon nitride for high thermal conductivity and strong interfacial bonding strength.
Authors: Hu, Jiabin1, Wu, Yajing1, Li, Cong1, Wang, Laili2, Wang, Shenghe3, Shi, Zhongqi1, zhongqishi@mail.xjtu.edu.cn
Source: Journal of Materials Science; Nov2021, Vol. 56 Issue 32, p17994-18005, 12p, 3 Color Photographs, 1 Black and White Photograph, 3 Diagrams, 5 Graphs
Database: Applied Science & Technology Source
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Description
ISSN:00222461
DOI:10.1007/s10853-021-06521-w