APA (7th ed.) Citation

Hu, J., Wu, Y., Li, C., Wang, L., Wang, S., & Shi, Z. (2021). Pressure-assisted direct bonding of copper to silicon nitride for high thermal conductivity and strong interfacial bonding strength. Journal of Materials Science, 56(32), 17994. https://doi.org/10.1007/s10853-021-06521-w

Chicago Style (17th ed.) Citation

Hu, Jiabin, Yajing Wu, Cong Li, Laili Wang, Shenghe Wang, and Zhongqi Shi. "Pressure-assisted Direct Bonding of Copper to Silicon Nitride for High Thermal Conductivity and Strong Interfacial Bonding Strength." Journal of Materials Science 56, no. 32 (2021): 17994. https://doi.org/10.1007/s10853-021-06521-w.

MLA (9th ed.) Citation

Hu, Jiabin, et al. "Pressure-assisted Direct Bonding of Copper to Silicon Nitride for High Thermal Conductivity and Strong Interfacial Bonding Strength." Journal of Materials Science, vol. 56, no. 32, 2021, p. 17994, https://doi.org/10.1007/s10853-021-06521-w.