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Pressure-assisted direct bonding of copper to silicon nitride for high thermal conductivity and strong interfacial bonding strength.

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Title: Pressure-assisted direct bonding of copper to silicon nitride for high thermal conductivity and strong interfacial bonding strength.
Authors: Hu, Jiabin1, Wu, Yajing1, Li, Cong1, Wang, Laili2, Wang, Shenghe3, Shi, Zhongqi1, zhongqishi@mail.xjtu.edu.cn
Source: Journal of Materials Science; Nov2021, Vol. 56 Issue 32, p17994-18005, 12p, 3 Color Photographs, 1 Black and White Photograph, 3 Diagrams, 5 Graphs
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 152655523
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Pressure-assisted direct bonding of copper to silicon nitride for high thermal conductivity and strong interfacial bonding strength.
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  Data: <searchLink fieldCode="AU" term="%22Hu%2C+Jiabin%22">Hu, Jiabin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wu%2C+Yajing%22">Wu, Yajing</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Cong%22">Li, Cong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Laili%22">Wang, Laili</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Shenghe%22">Wang, Shenghe</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Shi%2C+Zhongqi%22">Shi, Zhongqi</searchLink><relatesTo>1</relatesTo>, <i>zhongqishi@mail.xjtu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%22">Journal of Materials Science</searchLink>; Nov2021, Vol. 56 Issue 32, p17994-18005, 12p, 3 Color Photographs, 1 Black and White Photograph, 3 Diagrams, 5 Graphs
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=152655523
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10853-021-06521-w
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      – Code: eng
        Text: English
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        PageCount: 12
        StartPage: 17994
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      – TitleFull: Pressure-assisted direct bonding of copper to silicon nitride for high thermal conductivity and strong interfacial bonding strength.
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            NameFull: Hu, Jiabin
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            NameFull: Wu, Yajing
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            NameFull: Li, Cong
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            NameFull: Wang, Laili
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            NameFull: Wang, Shenghe
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            NameFull: Shi, Zhongqi
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            – D: 15
              M: 11
              Text: Nov2021
              Type: published
              Y: 2021
          Identifiers:
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              Value: 00222461
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              Value: 56
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              Value: 32
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            – TitleFull: Journal of Materials Science
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