Pressure-assisted direct bonding of copper to silicon nitride for high thermal conductivity and strong interfacial bonding strength.
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| Title: | Pressure-assisted direct bonding of copper to silicon nitride for high thermal conductivity and strong interfacial bonding strength. |
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| Authors: | Hu, Jiabin1, Wu, Yajing1, Li, Cong1, Wang, Laili2, Wang, Shenghe3, Shi, Zhongqi1, zhongqishi@mail.xjtu.edu.cn |
| Source: | Journal of Materials Science; Nov2021, Vol. 56 Issue 32, p17994-18005, 12p, 3 Color Photographs, 1 Black and White Photograph, 3 Diagrams, 5 Graphs |
| Database: | Applied Science & Technology Source |
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