Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints.
Saved in:
| Title: | Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints. |
|---|---|
| Authors: | Sharma, Ved Prakash1,2, Datla, Naresh Varma1, datla@mech.iitd.ac.in |
| Source: | Microelectronics Reliability; Dec2021, Vol. 127, pN.PAG-N.PAG, 1p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00262714 |
|---|---|
| DOI: | 10.1016/j.microrel.2021.114381 |
