Invited: Efficient System Architecture in the Era of Monolithic 3D: Dynamic Inter-tier Interconnect and Processing-in-Memory.
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| Title: | Invited: Efficient System Architecture in the Era of Monolithic 3D: Dynamic Inter-tier Interconnect and Processing-in-Memory. |
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| Authors: | Stow, Dylan1, dstow@ucsb.edu, Akgun, Itir1, Wenqin Huangfu1, Yuan Xie1, Xueqi Li2, Loh, Gabriel H.3 |
| Source: | DAC: Annual ACM/IEEE Design Automation Conference; 2019, Issue 56, p1243-1246, 4p |
| Database: | Applied Science & Technology Source |
| ISSN: | 0738100X |
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| DOI: | 10.1145/3316781.3323475 |
