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Invited: Efficient System Architecture in the Era of Monolithic 3D: Dynamic Inter-tier Interconnect and Processing-in-Memory.

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Title: Invited: Efficient System Architecture in the Era of Monolithic 3D: Dynamic Inter-tier Interconnect and Processing-in-Memory.
Authors: Stow, Dylan1, dstow@ucsb.edu, Akgun, Itir1, Wenqin Huangfu1, Yuan Xie1, Xueqi Li2, Loh, Gabriel H.3
Source: DAC: Annual ACM/IEEE Design Automation Conference; 2019, Issue 56, p1243-1246, 4p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 155539615
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PubType: Conference
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  Data: <searchLink fieldCode="AU" term="%22Stow%2C+Dylan%22">Stow, Dylan</searchLink><relatesTo>1</relatesTo>, <i>dstow@ucsb.edu</i><br /><searchLink fieldCode="AU" term="%22Akgun%2C+Itir%22">Akgun, Itir</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wenqin+Huangfu%22">Wenqin Huangfu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yuan+Xie%22">Yuan Xie</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xueqi+Li%22">Xueqi Li</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Loh%2C+Gabriel+H%2E%22">Loh, Gabriel H.</searchLink><relatesTo>3</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22DAC%3A+Annual+ACM%2FIEEE+Design+Automation+Conference%22">DAC: Annual ACM/IEEE Design Automation Conference</searchLink>; 2019, Issue 56, p1243-1246, 4p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=155539615
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        Value: 10.1145/3316781.3323475
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        Text: English
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              Text: 2019
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              Y: 2019
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