Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles.
Saved in:
| Title: | Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles. |
|---|---|
| Authors: | Yakymovych, Andriy1,2, yakymovychandriy@gmail.com, Plevachuk, Yuriy3, plevachuk@mail.lviv.ua, Orovcik, Lubomir4, Švec Sr., Peter5 |
| Source: | Applied Nanoscience; Apr2022, Vol. 12 Issue 4, p977-982, 6p |
| Database: | Applied Science & Technology Source |
| ISSN: | 21905509 |
|---|---|
| DOI: | 10.1007/s13204-021-01750-6 |