Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles.

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Bibliographic Details
Title: Nanocomposite SAC solders: the effect of heat treatment on the morphology of Sn–3.0Ag–0.5Cu/Cu solder joints reinforced with Ni and Ni–Sn nanoparticles.
Authors: Yakymovych, Andriy1,2, yakymovychandriy@gmail.com, Plevachuk, Yuriy3, plevachuk@mail.lviv.ua, Orovcik, Lubomir4, Švec Sr., Peter5
Source: Applied Nanoscience; Apr2022, Vol. 12 Issue 4, p977-982, 6p
Database: Applied Science & Technology Source
Description
ISSN:21905509
DOI:10.1007/s13204-021-01750-6