Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach.
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| Title: | Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach. |
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| Authors: | Chen, Tzu-Chia1, tzuchiachen1688@gmail.com, Opulencia, Maria Jade Catalan2, Majdi, Hasan Sh.3, Hammid, Ali Thaeer4, Sharma, Himanshu5, Sajjadifar, Sami6, Surendar, Aravindhan7, asurendar688@gmail.com |
| Source: | Journal of Electronic Materials; Jul2022, Vol. 51 Issue 7, p3495-3503, 9p |
| Database: | Applied Science & Technology Source |
| ISSN: | 03615235 |
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| DOI: | 10.1007/s11664-022-09635-2 |
