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Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach.

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Title: Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach.
Authors: Chen, Tzu-Chia1, tzuchiachen1688@gmail.com, Opulencia, Maria Jade Catalan2, Majdi, Hasan Sh.3, Hammid, Ali Thaeer4, Sharma, Himanshu5, Sajjadifar, Sami6, Surendar, Aravindhan7, asurendar688@gmail.com
Source: Journal of Electronic Materials; Jul2022, Vol. 51 Issue 7, p3495-3503, 9p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 157213611
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PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach.
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        Value: 10.1007/s11664-022-09635-2
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      – Code: eng
        Text: English
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        PageCount: 9
        StartPage: 3495
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      – TitleFull: Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach.
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            NameFull: Chen, Tzu-Chia
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            NameFull: Sharma, Himanshu
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            – D: 01
              M: 07
              Text: Jul2022
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              Y: 2022
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