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A Low-Temperature Batch Process for the Deposition of High-Quality Conformal Alumina Thin Films for Electronic Applications.

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Title: A Low-Temperature Batch Process for the Deposition of High-Quality Conformal Alumina Thin Films for Electronic Applications.
Authors: Burwell, Gregory1,2, g.burwell@swansea.ac.uk, Rejnhard, Klaudia1,2, Evans, Jon2, Mitchell, Jacob2, Grimes, Michael T.3, Elwin, Matt2, Armin, Ardalan1,2, Meredith, Paul1,2, paul.meredith@swansea.ac.uk
Source: Advanced Engineering Materials; Jun2023, Vol. 25 Issue 12, p1-12, 12p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 169860774
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: A Low-Temperature Batch Process for the Deposition of High-Quality Conformal Alumina Thin Films for Electronic Applications.
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=169860774
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      – Type: doi
        Value: 10.1002/adem.202201901
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      – Code: eng
        Text: English
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        PageCount: 12
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      – TitleFull: A Low-Temperature Batch Process for the Deposition of High-Quality Conformal Alumina Thin Films for Electronic Applications.
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            – D: 15
              M: 06
              Text: Jun2023
              Type: published
              Y: 2023
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