A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability.
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| Title: | A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability. |
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| Authors: | Saleh, A. S.1,2, Croes, K.2, Ceric, H.3, De Wolf, I.1,2, Zahedmanesh, H.2, Houman.Zahedmanesh@imec.be |
| Source: | Journal of Applied Physics; 10/7/2023, Vol. 134 Issue 13, p1-12, 12p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00218979 |
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| DOI: | 10.1063/5.0165949 |
