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A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability.

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Title: A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability.
Authors: Saleh, A. S.1,2, Croes, K.2, Ceric, H.3, De Wolf, I.1,2, Zahedmanesh, H.2, Houman.Zahedmanesh@imec.be
Source: Journal of Applied Physics; 10/7/2023, Vol. 134 Issue 13, p1-12, 12p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 172853897
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability.
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  Data: <searchLink fieldCode="AU" term="%22Saleh%2C+A%2E+S%2E%22">Saleh, A. S.</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Croes%2C+K%2E%22">Croes, K.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Ceric%2C+H%2E%22">Ceric, H.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22De+Wolf%2C+I%2E%22">De Wolf, I.</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zahedmanesh%2C+H%2E%22">Zahedmanesh, H.</searchLink><relatesTo>2</relatesTo>, <i>Houman.Zahedmanesh@imec.be</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Applied+Physics%22">Journal of Applied Physics</searchLink>; 10/7/2023, Vol. 134 Issue 13, p1-12, 12p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=172853897
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      – Type: doi
        Value: 10.1063/5.0165949
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      – Code: eng
        Text: English
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        PageCount: 12
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      – TitleFull: A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability.
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            NameFull: Saleh, A. S.
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            NameFull: Ceric, H.
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              Text: 10/7/2023
              Type: published
              Y: 2023
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              Value: 134
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