Bibliographic Details
| Title: |
Characterization of superconducting through-silicon vias as capacitive elements in quantum circuits. |
| Authors: |
Hazard, T. M.1, thomas.hazard@ll.mit.edu, Woods, W.1, Rosenberg, D.1, Das, R.1, Hirjibehedin, C. F.1, Kim, D. K.1, Knecht, J. M.1, Mallek, J.1, Melville, A.1, Niedzielski, B. M.1, Serniak, K.1,2, Sliwa, K. M.1, Yost, D. R. W.1, Yoder, J. L.1, Oliver, W. D.1,2,3,4, Schwartz, M. E.1, mollie.schwartz@ll.mit.edu |
| Source: |
Applied Physics Letters; 10/9/2023, Vol. 123 Issue 15, p1-6, 6p |
| Database: |
Applied Science & Technology Source |
