A review on future novel interconnect and polymeric materials for cryogenic memory packaging.
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| Title: | A review on future novel interconnect and polymeric materials for cryogenic memory packaging. |
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| Authors: | Gan, C. L.1, clgan@micron.com, Huang, Chen Yu1, Zou, Yung Sheng1, Chung, Min Hua1, Takiar, Hem2 |
| Source: | Journal of Materials Science: Materials in Electronics; Oct2023, Vol. 34 Issue 29, p1-15, 15p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-023-11389-4 |
