APA (7th ed.) Citation

Gan, C. L., Huang, C. Y., Zou, Y. S., Chung, M. H., & Takiar, H. (2023). A review on future novel interconnect and polymeric materials for cryogenic memory packaging. Journal of Materials Science: Materials in Electronics, 34(29), 1. https://doi.org/10.1007/s10854-023-11389-4

Chicago Style (17th ed.) Citation

Gan, C. L., Chen Yu Huang, Yung Sheng Zou, Min Hua Chung, and Hem Takiar. "A Review on Future Novel Interconnect and Polymeric Materials for Cryogenic Memory Packaging." Journal of Materials Science: Materials in Electronics 34, no. 29 (2023): 1. https://doi.org/10.1007/s10854-023-11389-4.

MLA (9th ed.) Citation

Gan, C. L., et al. "A Review on Future Novel Interconnect and Polymeric Materials for Cryogenic Memory Packaging." Journal of Materials Science: Materials in Electronics, vol. 34, no. 29, 2023, p. 1, https://doi.org/10.1007/s10854-023-11389-4.