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A review on future novel interconnect and polymeric materials for cryogenic memory packaging.

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Title: A review on future novel interconnect and polymeric materials for cryogenic memory packaging.
Authors: Gan, C. L.1, clgan@micron.com, Huang, Chen Yu1, Zou, Yung Sheng1, Chung, Min Hua1, Takiar, Hem2
Source: Journal of Materials Science: Materials in Electronics; Oct2023, Vol. 34 Issue 29, p1-15, 15p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 173133573
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: A review on future novel interconnect and polymeric materials for cryogenic memory packaging.
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  Data: <searchLink fieldCode="AU" term="%22Gan%2C+C%2E+L%2E%22">Gan, C. L.</searchLink><relatesTo>1</relatesTo>, <i>clgan@micron.com</i><br /><searchLink fieldCode="AU" term="%22Huang%2C+Chen+Yu%22">Huang, Chen Yu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zou%2C+Yung+Sheng%22">Zou, Yung Sheng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chung%2C+Min+Hua%22">Chung, Min Hua</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Takiar%2C+Hem%22">Takiar, Hem</searchLink><relatesTo>2</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Oct2023, Vol. 34 Issue 29, p1-15, 15p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=173133573
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-023-11389-4
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      – Code: eng
        Text: English
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        PageCount: 15
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      – TitleFull: A review on future novel interconnect and polymeric materials for cryogenic memory packaging.
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            NameFull: Gan, C. L.
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            NameFull: Huang, Chen Yu
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            NameFull: Zou, Yung Sheng
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            NameFull: Chung, Min Hua
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              Text: Oct2023
              Type: published
              Y: 2023
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              Value: 09574522
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              Value: 34
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              Value: 29
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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