The Influence of Plasma Treatment and Substrate Bias Voltage on the Bonding Properties of Carbon Fiber/Copper Composites.
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| Title: | The Influence of Plasma Treatment and Substrate Bias Voltage on the Bonding Properties of Carbon Fiber/Copper Composites. |
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| Authors: | Wang, Ruijun1, Liu, Jingbo2, Wang, Tianshi2, Pang, Xiaolu1, Xu, Lining1, xulining@ustb.edu.cn, Qiao, Lijie1 |
| Source: | Journal of Materials Engineering & Performance; Dec2023, Vol. 32 Issue 23, p10924-10933, 10p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10599495 |
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| DOI: | 10.1007/s11665-023-07894-6 |
