APA (7th ed.) Citation

Wang, R., Liu, J., Wang, T., Pang, X., Xu, L., & Qiao, L. (2023). The Influence of Plasma Treatment and Substrate Bias Voltage on the Bonding Properties of Carbon Fiber/Copper Composites. Journal of Materials Engineering & Performance, 32(23), 10924. https://doi.org/10.1007/s11665-023-07894-6

Chicago Style (17th ed.) Citation

Wang, Ruijun, Jingbo Liu, Tianshi Wang, Xiaolu Pang, Lining Xu, and Lijie Qiao. "The Influence of Plasma Treatment and Substrate Bias Voltage on the Bonding Properties of Carbon Fiber/Copper Composites." Journal of Materials Engineering & Performance 32, no. 23 (2023): 10924. https://doi.org/10.1007/s11665-023-07894-6.

MLA (9th ed.) Citation

Wang, Ruijun, et al. "The Influence of Plasma Treatment and Substrate Bias Voltage on the Bonding Properties of Carbon Fiber/Copper Composites." Journal of Materials Engineering & Performance, vol. 32, no. 23, 2023, p. 10924, https://doi.org/10.1007/s11665-023-07894-6.