Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-in situ study combining 3D microstructural characterization and numerical simulation.
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| Title: | Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-in situ study combining 3D microstructural characterization and numerical simulation. |
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| Authors: | Yuan, H. Y.1, Li, C.1, Zhang, H. Z.1, Fan, M. Z.1, Ma, Z. L.1,2,3, z.l.ma@bit.edu.cn, Cheng, X. W.1,2,3 |
| Source: | Applied Physics Letters; 12/4/2023, Vol. 123 Issue 23, p1-8, 8p |
| Database: | Applied Science & Technology Source |
| ISSN: | 00036951 |
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| DOI: | 10.1063/5.0176416 |
