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Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-in situ study combining 3D microstructural characterization and numerical simulation.

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Title: Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-in situ study combining 3D microstructural characterization and numerical simulation.
Authors: Yuan, H. Y.1, Li, C.1, Zhang, H. Z.1, Fan, M. Z.1, Ma, Z. L.1,2,3, z.l.ma@bit.edu.cn, Cheng, X. W.1,2,3
Source: Applied Physics Letters; 12/4/2023, Vol. 123 Issue 23, p1-8, 8p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 174100537
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
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  Data: Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-in situ study combining 3D microstructural characterization and numerical simulation.
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  Data: <searchLink fieldCode="AU" term="%22Yuan%2C+H%2E+Y%2E%22">Yuan, H. Y.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+C%2E%22">Li, C.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+H%2E+Z%2E%22">Zhang, H. Z.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Fan%2C+M%2E+Z%2E%22">Fan, M. Z.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ma%2C+Z%2E+L%2E%22">Ma, Z. L.</searchLink><relatesTo>1,2,3</relatesTo>, <i>z.l.ma@bit.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Cheng%2C+X%2E+W%2E%22">Cheng, X. W.</searchLink><relatesTo>1,2,3</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Applied+Physics+Letters%22">Applied Physics Letters</searchLink>; 12/4/2023, Vol. 123 Issue 23, p1-8, 8p
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        Value: 10.1063/5.0176416
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        Text: English
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      – TitleFull: Revealing evolutions of intermetallics in a solder joint under electromigration: A quasi-in situ study combining 3D microstructural characterization and numerical simulation.
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              Text: 12/4/2023
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              Y: 2023
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