High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability.
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| Title: | High‐Yield‐Stress Particle‐Stabilized Emulsion for Form‐Factor‐Free Thermal Pastes with High Thermal Conductivity, Stability, and Recyclability. |
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| Authors: | Min, Seong‐Bae1, Jo, Yongsu1, Ryu, Seoung Young2, Lee, Joohyung2, ljbro@mju.ac.kr, Ahn, Cheol‐Woo3, cheoruahn@kims.re.kr, Kim, Chae Bin1,4, cbkim@pusan.ac.kr |
| Source: | Advanced Materials Interfaces; 2/23/2024, Vol. 11 Issue 6, p1-13, 13p |
| Database: | Applied Science & Technology Source |
| ISSN: | 21967350 |
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| DOI: | 10.1002/admi.202300860 |
