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Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)

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Bibliographic Details
Title: Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)
Authors: Hsu, Ya-Hui1, Lo, Mei-Hsin1, Lee, Yu-Chun1, Huang, Wei-Chieh1, Chang, Jui-Sheng1, Wang, Yu-Po2, Liu, Cheng-Yi1, chengyiliuoem@gmail.com
Source: Journal of Materials Science: Materials in Electronics; Apr2024, Vol. 35 Issue 10, p1-11, 11p
Database: Applied Science & Technology Source
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ISSN:09574522
DOI:10.1007/s10854-024-12391-0