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Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)

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Title: Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)
Authors: Hsu, Ya-Hui1, Lo, Mei-Hsin1, Lee, Yu-Chun1, Huang, Wei-Chieh1, Chang, Jui-Sheng1, Wang, Yu-Po2, Liu, Cheng-Yi1, chengyiliuoem@gmail.com
Source: Journal of Materials Science: Materials in Electronics; Apr2024, Vol. 35 Issue 10, p1-11, 11p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 176778026
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Hsu%2C+Ya-Hui%22">Hsu, Ya-Hui</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lo%2C+Mei-Hsin%22">Lo, Mei-Hsin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lee%2C+Yu-Chun%22">Lee, Yu-Chun</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Huang%2C+Wei-Chieh%22">Huang, Wei-Chieh</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chang%2C+Jui-Sheng%22">Chang, Jui-Sheng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Yu-Po%22">Wang, Yu-Po</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Liu%2C+Cheng-Yi%22">Liu, Cheng-Yi</searchLink><relatesTo>1</relatesTo>, <i>chengyiliuoem@gmail.com</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Apr2024, Vol. 35 Issue 10, p1-11, 11p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=176778026
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-024-12391-0
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 11
        StartPage: 1
    Titles:
      – TitleFull: Effect of expelling P content on Ni(P) dissolution and reaction with SnAgCu(Ni)
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Hsu, Ya-Hui
      – PersonEntity:
          Name:
            NameFull: Lo, Mei-Hsin
      – PersonEntity:
          Name:
            NameFull: Lee, Yu-Chun
      – PersonEntity:
          Name:
            NameFull: Huang, Wei-Chieh
      – PersonEntity:
          Name:
            NameFull: Chang, Jui-Sheng
      – PersonEntity:
          Name:
            NameFull: Wang, Yu-Po
      – PersonEntity:
          Name:
            NameFull: Liu, Cheng-Yi
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 04
              Text: Apr2024
              Type: published
              Y: 2024
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 35
            – Type: issue
              Value: 10
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1