Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection.
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| Title: | Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection. |
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| Authors: | Luo, Canlin1, Lin, Chang1,2, Ye, Jinyu1, Zeng, Huangjie1, Zhou, Xiongtu1,2, xtzhou@fzu.edu.cn, Wu, Chaoxing1,2, Zhang, Yongai1,2, yongaizhang@fzu.edu.cn, Sun, Jie1,2, Guo, Tailiang1,2, Yan, Qun1,2, qunfyan@gmail.com |
| Source: | Journal of Materials Science: Materials in Electronics; Apr2024, Vol. 35 Issue 12, p1-11, 11p |
| Database: | Applied Science & Technology Source |
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| ISSN: | 09574522 |
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| DOI: | 10.1007/s10854-024-12645-x |
