APA (7th ed.) Citation

Luo, C., Lin, C., Ye, J., Zeng, H., Zhou, X., Wu, C., . . . Yan, Q. (2024). Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection. Journal of Materials Science: Materials in Electronics, 35(12), 1. https://doi.org/10.1007/s10854-024-12645-x

Chicago Style (17th ed.) Citation

Luo, Canlin, et al. "Electroplating of Cu/Sn Bumps with Ultrafine Pitch and High Uniformity for Micro-LED Interconnection." Journal of Materials Science: Materials in Electronics 35, no. 12 (2024): 1. https://doi.org/10.1007/s10854-024-12645-x.

MLA (9th ed.) Citation

Luo, Canlin, et al. "Electroplating of Cu/Sn Bumps with Ultrafine Pitch and High Uniformity for Micro-LED Interconnection." Journal of Materials Science: Materials in Electronics, vol. 35, no. 12, 2024, p. 1, https://doi.org/10.1007/s10854-024-12645-x.