Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection.
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| Title: | Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection. |
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| Authors: | Luo, Canlin1, Lin, Chang1,2, Ye, Jinyu1, Zeng, Huangjie1, Zhou, Xiongtu1,2, xtzhou@fzu.edu.cn, Wu, Chaoxing1,2, Zhang, Yongai1,2, yongaizhang@fzu.edu.cn, Sun, Jie1,2, Guo, Tailiang1,2, Yan, Qun1,2, qunfyan@gmail.com |
| Source: | Journal of Materials Science: Materials in Electronics; Apr2024, Vol. 35 Issue 12, p1-11, 11p |
| Database: | Applied Science & Technology Source |
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| FullText | Links: – Type: pdflink Text: Availability: 1 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 176964939 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Luo%2C+Canlin%22">Luo, Canlin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lin%2C+Chang%22">Lin, Chang</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Ye%2C+Jinyu%22">Ye, Jinyu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zeng%2C+Huangjie%22">Zeng, Huangjie</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhou%2C+Xiongtu%22">Zhou, Xiongtu</searchLink><relatesTo>1,2</relatesTo>, <i>xtzhou@fzu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Wu%2C+Chaoxing%22">Wu, Chaoxing</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Yongai%22">Zhang, Yongai</searchLink><relatesTo>1,2</relatesTo>, <i>yongaizhang@fzu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Sun%2C+Jie%22">Sun, Jie</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Guo%2C+Tailiang%22">Guo, Tailiang</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yan%2C+Qun%22">Yan, Qun</searchLink><relatesTo>1,2</relatesTo>, <i>qunfyan@gmail.com</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Apr2024, Vol. 35 Issue 12, p1-11, 11p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=176964939 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10854-024-12645-x Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 11 StartPage: 1 Titles: – TitleFull: Electroplating of Cu/Sn bumps with ultrafine pitch and high uniformity for micro-LED interconnection. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Luo, Canlin – PersonEntity: Name: NameFull: Lin, Chang – PersonEntity: Name: NameFull: Ye, Jinyu – PersonEntity: Name: NameFull: Zeng, Huangjie – PersonEntity: Name: NameFull: Zhou, Xiongtu – PersonEntity: Name: NameFull: Wu, Chaoxing – PersonEntity: Name: NameFull: Zhang, Yongai – PersonEntity: Name: NameFull: Sun, Jie – PersonEntity: Name: NameFull: Guo, Tailiang – PersonEntity: Name: NameFull: Yan, Qun IsPartOfRelationships: – BibEntity: Dates: – D: 21 M: 04 Text: Apr2024 Type: published Y: 2024 Identifiers: – Type: issn-print Value: 09574522 Numbering: – Type: volume Value: 35 – Type: issue Value: 12 Titles: – TitleFull: Journal of Materials Science: Materials in Electronics Type: main |
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