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Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification.

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Bibliographic Details
Title: Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification.
Authors: Tu, Wenbin1, wenbintu@nchu.edu.cn, Wang, Hanbing1, Wang, Shanlin1, Chen, Yuhua1, yuhuachen@nchu.edu.cn, Wei, Mingwei1, Zhang, Timing1, Xie, Jilin1
Source: Journal of Electronic Materials; Jun2024, Vol. 53 Issue 6, p3049-3062, 14p
Database: Applied Science & Technology Source
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ISSN:03615235
DOI:10.1007/s11664-024-11029-5