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Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification.

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Title: Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification.
Authors: Tu, Wenbin1, wenbintu@nchu.edu.cn, Wang, Hanbing1, Wang, Shanlin1, Chen, Yuhua1, yuhuachen@nchu.edu.cn, Wei, Mingwei1, Zhang, Timing1, Xie, Jilin1
Source: Journal of Electronic Materials; Jun2024, Vol. 53 Issue 6, p3049-3062, 14p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 178046876
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Label: Title
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  Data: Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification.
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  Data: <searchLink fieldCode="AU" term="%22Tu%2C+Wenbin%22">Tu, Wenbin</searchLink><relatesTo>1</relatesTo>, <i>wenbintu@nchu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Wang%2C+Hanbing%22">Wang, Hanbing</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Shanlin%22">Wang, Shanlin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Yuhua%22">Chen, Yuhua</searchLink><relatesTo>1</relatesTo>, <i>yuhuachen@nchu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Wei%2C+Mingwei%22">Wei, Mingwei</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhang%2C+Timing%22">Zhang, Timing</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xie%2C+Jilin%22">Xie, Jilin</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Jun2024, Vol. 53 Issue 6, p3049-3062, 14p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=178046876
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s11664-024-11029-5
    Languages:
      – Code: eng
        Text: English
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      Pagination:
        PageCount: 14
        StartPage: 3049
    Titles:
      – TitleFull: Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification.
        Type: main
  BibRelationships:
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      – PersonEntity:
          Name:
            NameFull: Tu, Wenbin
      – PersonEntity:
          Name:
            NameFull: Wang, Hanbing
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            NameFull: Wang, Shanlin
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            NameFull: Chen, Yuhua
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            NameFull: Wei, Mingwei
      – PersonEntity:
          Name:
            NameFull: Zhang, Timing
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            NameFull: Xie, Jilin
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          Dates:
            – D: 01
              M: 06
              Text: Jun2024
              Type: published
              Y: 2024
          Identifiers:
            – Type: issn-print
              Value: 03615235
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              Value: 53
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              Value: 6
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            – TitleFull: Journal of Electronic Materials
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