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Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler.

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Bibliographic Details
Title:	Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler.
Authors:	Tang, Liangliang^1,2, Yao, Dongxu¹, Xia, Yongfeng¹, Zhao, Jun¹, Zhu, Ming¹, Zeng, Yu‐Ping¹, yuping-zeng@mail.sic.ac.cn
Source:	Journal of the American Ceramic Society; Sep2024, Vol. 107 Issue 9, p6439-6455, 17p
Database:	Applied Science & Technology Source
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Description
ISSN:	00027820
DOI:	10.1111/jace.19921