Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler.
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| Title: | Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler. |
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| Authors: | Tang, Liangliang1,2, Yao, Dongxu1, Xia, Yongfeng1, Zhao, Jun1, Zhu, Ming1, Zeng, Yu‐Ping1, yuping-zeng@mail.sic.ac.cn |
| Source: | Journal of the American Ceramic Society; Sep2024, Vol. 107 Issue 9, p6439-6455, 17p |
| Database: | Applied Science & Technology Source |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 178178790 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Tang%2C+Liangliang%22">Tang, Liangliang</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yao%2C+Dongxu%22">Yao, Dongxu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xia%2C+Yongfeng%22">Xia, Yongfeng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhao%2C+Jun%22">Zhao, Jun</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhu%2C+Ming%22">Zhu, Ming</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zeng%2C+Yu‐Ping%22">Zeng, Yu‐Ping</searchLink><relatesTo>1</relatesTo>, <i>yuping-zeng@mail.sic.ac.cn</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+the+American+Ceramic+Society%22">Journal of the American Ceramic Society</searchLink>; Sep2024, Vol. 107 Issue 9, p6439-6455, 17p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=178178790 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1111/jace.19921 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 17 StartPage: 6439 Titles: – TitleFull: Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Tang, Liangliang – PersonEntity: Name: NameFull: Yao, Dongxu – PersonEntity: Name: NameFull: Xia, Yongfeng – PersonEntity: Name: NameFull: Zhao, Jun – PersonEntity: Name: NameFull: Zhu, Ming – PersonEntity: Name: NameFull: Zeng, Yu‐Ping IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 09 Text: Sep2024 Type: published Y: 2024 Identifiers: – Type: issn-print Value: 00027820 Numbering: – Type: volume Value: 107 – Type: issue Value: 9 Titles: – TitleFull: Journal of the American Ceramic Society Type: main |
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