Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler.

Saved in:
Bibliographic Details
Title: Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler.
Authors: Tang, Liangliang1,2, Yao, Dongxu1, Xia, Yongfeng1, Zhao, Jun1, Zhu, Ming1, Zeng, Yu‐Ping1, yuping-zeng@mail.sic.ac.cn
Source: Journal of the American Ceramic Society; Sep2024, Vol. 107 Issue 9, p6439-6455, 17p
Database: Applied Science & Technology Source
Full text is not displayed to guests.
FullText Links:
  – Type: pdflink
Text:
  Availability: 1
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 178178790
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Tang%2C+Liangliang%22">Tang, Liangliang</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yao%2C+Dongxu%22">Yao, Dongxu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Xia%2C+Yongfeng%22">Xia, Yongfeng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhao%2C+Jun%22">Zhao, Jun</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhu%2C+Ming%22">Zhu, Ming</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Zeng%2C+Yu‐Ping%22">Zeng, Yu‐Ping</searchLink><relatesTo>1</relatesTo>, <i>yuping-zeng@mail.sic.ac.cn</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+the+American+Ceramic+Society%22">Journal of the American Ceramic Society</searchLink>; Sep2024, Vol. 107 Issue 9, p6439-6455, 17p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=178178790
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1111/jace.19921
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 17
        StartPage: 6439
    Titles:
      – TitleFull: Joining of silicon nitride ceramic to oxygen‐free copper using Ag–Cu–TiH2 filler.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Tang, Liangliang
      – PersonEntity:
          Name:
            NameFull: Yao, Dongxu
      – PersonEntity:
          Name:
            NameFull: Xia, Yongfeng
      – PersonEntity:
          Name:
            NameFull: Zhao, Jun
      – PersonEntity:
          Name:
            NameFull: Zhu, Ming
      – PersonEntity:
          Name:
            NameFull: Zeng, Yu‐Ping
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 09
              Text: Sep2024
              Type: published
              Y: 2024
          Identifiers:
            – Type: issn-print
              Value: 00027820
          Numbering:
            – Type: volume
              Value: 107
            – Type: issue
              Value: 9
          Titles:
            – TitleFull: Journal of the American Ceramic Society
              Type: main
ResultId 1