Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films.
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| Title: | Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films. |
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| Authors: | Lai, Yu-Chang1, Yang, Zi-Hong1, Chen, Yin-Hsuan1, Chen, Yen-Ting1, Lin, Ang-Ying1, Chuang, Tung-Han1,2, tunghan@ntu.edu.tw |
| Source: | Journal of Materials Engineering & Performance; Aug2024, Vol. 33 Issue 16, p8044-8056, 13p |
| Database: | Applied Science & Technology Source |
| ISSN: | 10599495 |
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| DOI: | 10.1007/s11665-023-08534-9 |
