APA (7th ed.) Citation

Lai, Y., Yang, Z., Chen, Y., Chen, Y., Lin, A., & Chuang, T. (2024). Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films. Journal of Materials Engineering & Performance, 33(16), 8044. https://doi.org/10.1007/s11665-023-08534-9

Chicago Style (17th ed.) Citation

Lai, Yu-Chang, Zi-Hong Yang, Yin-Hsuan Chen, Yen-Ting Chen, Ang-Ying Lin, and Tung-Han Chuang. "Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films." Journal of Materials Engineering & Performance 33, no. 16 (2024): 8044. https://doi.org/10.1007/s11665-023-08534-9.

MLA (9th ed.) Citation

Lai, Yu-Chang, et al. "Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films." Journal of Materials Engineering & Performance, vol. 33, no. 16, 2024, p. 8044, https://doi.org/10.1007/s11665-023-08534-9.