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Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films.

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Title: Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films.
Authors: Lai, Yu-Chang1, Yang, Zi-Hong1, Chen, Yin-Hsuan1, Chen, Yen-Ting1, Lin, Ang-Ying1, Chuang, Tung-Han1,2, tunghan@ntu.edu.tw
Source: Journal of Materials Engineering & Performance; Aug2024, Vol. 33 Issue 16, p8044-8056, 13p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 179414615
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Label: Title
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  Data: Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films.
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  Data: <searchLink fieldCode="AU" term="%22Lai%2C+Yu-Chang%22">Lai, Yu-Chang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yang%2C+Zi-Hong%22">Yang, Zi-Hong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Yin-Hsuan%22">Chen, Yin-Hsuan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Yen-Ting%22">Chen, Yen-Ting</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Lin%2C+Ang-Ying%22">Lin, Ang-Ying</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chuang%2C+Tung-Han%22">Chuang, Tung-Han</searchLink><relatesTo>1,2</relatesTo>, <i>tunghan@ntu.edu.tw</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Engineering+%26+Performance%22">Journal of Materials Engineering & Performance</searchLink>; Aug2024, Vol. 33 Issue 16, p8044-8056, 13p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=179414615
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s11665-023-08534-9
    Languages:
      – Code: eng
        Text: English
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      Pagination:
        PageCount: 13
        StartPage: 8044
    Titles:
      – TitleFull: Low Temperature Diffusion Bonding of Si Chips Sputtered with High Density (111)-Ag Nanotwinned Films.
        Type: main
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          Name:
            NameFull: Lai, Yu-Chang
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            NameFull: Yang, Zi-Hong
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            NameFull: Chen, Yin-Hsuan
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            NameFull: Chen, Yen-Ting
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            NameFull: Lin, Ang-Ying
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            NameFull: Chuang, Tung-Han
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          Dates:
            – D: 15
              M: 08
              Text: Aug2024
              Type: published
              Y: 2024
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              Value: 10599495
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              Value: 33
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              Value: 16
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            – TitleFull: Journal of Materials Engineering & Performance
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