Optimization of surface filtration to enhance wafer uniformity by removing large particle in ceria slurry.
Saved in:
| Title: | Optimization of surface filtration to enhance wafer uniformity by removing large particle in ceria slurry. |
|---|---|
| Authors: | Oh, Seungjun1, Back, Geumji1,2, Park, Sanghyeon1, Lee, HunWook3, Seo, Heedo3, Kim, Yoonsub3, Kim, Taesung1,2,4, tkim@skku.edu |
| Source: | Materials Science in Semiconductor Processing; Nov2024, Vol. 183, pN.PAG-N.PAG, 1p |
| Database: | Applied Science & Technology Source |
| ISSN: | 13698001 |
|---|---|
| DOI: | 10.1016/j.mssp.2024.108740 |
