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Optimization of surface filtration to enhance wafer uniformity by removing large particle in ceria slurry.

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Bibliographic Details
Title: Optimization of surface filtration to enhance wafer uniformity by removing large particle in ceria slurry.
Authors: Oh, Seungjun1, Back, Geumji1,2, Park, Sanghyeon1, Lee, HunWook3, Seo, Heedo3, Kim, Yoonsub3, Kim, Taesung1,2,4, tkim@skku.edu
Source: Materials Science in Semiconductor Processing; Nov2024, Vol. 183, pN.PAG-N.PAG, 1p
Database: Applied Science & Technology Source
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